1 / 4 www.asb.co.kr november 2008 p lerow tm aln0195at internally matched lna module the plerow tm aln - series is the compactly designed surface - mount module for the use of the lna with or without the following gain blocks in the infrastructure equi pment of the mobile wireless (cdma, gsm, pcs, phs, wcdma, dmb, wlan, wibro, wimax), gps, satellite commun i- cation terminals , catv and so on. it has an exceptional performance of low noise figure, high gain, high oip3, and low bias current. the stability fac tor is always kept more than unity over the application band in order to ensure its unconditionally stable implementation to the application system environment. the surface - mount module package including the completed matching circuit and other components necessary just in case allows very simple and convenient implementation onto the system board in mass production level. parameter unit specifications min typ max frequency range mhz 180 210 gain db 20 21 gain flatness db ? 0.5 ? 0.7 noise figure db 1.0 1.05 output ip3 (1) dbm 31 32 s11 / s22 (2) db - 20 / - 15 output p1db dbm 17 18 switching time ? sec - supply current ma 65 75 supply voltage v 5 impedance ? 50 max. rf input power dbm c.w 29 ~ 31 (before fail) package type & size mm surface mount type, 10wx10lx3.8h operating temperature is - 40 ? c to +85 ? c. 1) oip3 is measured with two tones at an output power of 4 dbm / tone separated by 1 mhz. 2) s11/s22 (max) is the worst value within the frequency band. 3) switching time means the time that takes for output power to get stabilized to its final level after switching dc voltage fr om 0 v to v s . pin number function 2 rf in 5 rf out 6 +vcc other s ground ou t line drawing (unit: mm) feature s s 21 = 20.5 db @ 180 mhz = 21.5 db @ 210 mhz nf of 1.0 db over fr e quency unconditionally stable single 5v supply high oip3 @ low current note: 1. the numbe r and size of ground via holes in a circuit board is critical for thermal rf grounding consider a tions. 2. we recommend that the ground via holes be placed on the bottom of all ground pins for better rf and thermal performance, as shown in the dra w ing at th e left side. description (recommended footprint) aln0195at asb inc. (top view) (bottom view) ? 0.4 plated thru holes to ground plane plerow (side view) c o u pl er website: www.asb.co.kr e - mail: sales@asb.co.kr tel: (82) 42 - 528 - 722 3 f ax : (82) 42 - 528 - 7222 more inform a tion c o u pl er c o u pl er c o u pl er c o u pl er 1 - stage single type specifications (in pr o duction) typ. @ t = 25 ? c, v s = 5 v, freq. = 195 mhz, z o.sys =50 ohm solder stencil area
2 / 4 www.asb.co.kr november 2008 p lerow tm aln0195at internally matched lna module s - param e ters noise figure oip3 p1db 180~210 mhz +5 v stability fa c tor (k) typical performance (measured) 180 185 190 195 200 205 210 -30 -25 -20 -15 -10 -5 0 19.0 19.5 20.0 20.5 21.0 21.5 22.0 s12 s11 s22 s21 s21 [db] s11, s22, s12 [db] frequency [mhz] 0 500 1000 1500 2000 2500 3000 3500 0 1 2 3 4 5 6 7 8 9 10 stability factor k frequency [mhz]
3 / 4 www.asb.co.kr november 2008 p lerow tm aln0195at internally matched lna module item vol t age s11 (db) s22 (db) s21 (db) g/f (db) nf (db) p1db (dbm) oip3 (dbm) curre nt (ma) 4.5 - 23.4 - 17.7 21.1 0.08 0.971 17.9 30.2 50 4.6 - 22.7 - 17.3 21.1 0.08 0.974 18.2 30.9 53 4.7 - 22.4 - 16.9 21.2 0.08 0.978 18.5 31.6 56 4.8 - 21.3 - 16.7 21.2 0.09 0.981 18.8 32.3 59 4.9 - 21.3 - 16.7 21.3 0.09 0.983 19 33.1 62 5.0 - 21.2 - 16.5 21. 3 0.08 0.985 19.2 33.9 65 5.1 - 20.9 - 16.5 21.3 0.08 0.987 19.4 34.7 68 5.2 - 20.6 - 16.4 21.3 0.08 0.991 19.6 35.5 71 5.3 - 20.5 - 16.4 21.3 0.06 0.993 19.7 36.7 74 5.4 - 20.3 - 16.3 21.4 0.07 0.996 19.9 36.5 76 5.5 - 20.4 - 16.3 21.4 0.08 0.998 19.9 36.5 79 item temp. s11 (db) s22 (db) s21 (db) g/f (db) nf (db) p1db (dbm) oip3 (dbm) current (ma) - 40 ? c - 19.4 - 15.7 21.5 0.12 0.754 18.8 33.3 61 - 20 ? c - 19.9 - 15.6 21.4 0.08 0.842 18.3 32 62 0 ? c - 20.5 - 16 21.4 0.08 0.913 18 32 64 25 ? c - 21.1 - 16.6 21.3 0.09 0.98 19.1 33.4 65 40 ? c - 21.8 - 16.9 21.2 0.07 1.021 18.9 33.4 65 60 ? c - 22.6 - 17.7 21.1 0.07 1.053 18.7 34.1 66 80 ? c - 23.6 - 18.4 21 0.08 1.077 18.3 33.8 65 100 ? c - 24.7 - 19.4 20.9 0.07 1.102 18 33.9 63 rf performance with voltage change rf performance with operating temperature
4 / 4 www.asb.co.kr november 2008 p lerow tm aln0195at internally matched lna module 1) the tant al capacitor is optional and for bypassing the ac noise introduced from the dc supply. the capacitance value may be dete r mined by customer s dc supply status. 2) so - called dc blocking capacitors are always necessarily placed at the input and output port for a llowing only the rf signal to pass and blocking the dc component in the signal. the dc blocking capacitors are included inside the lna module. therefore, c1 & c2 capacitors may not be necessary, but can be added just in case that the customer wants. the va lue of c1 & c2 is determined by considering the application fr e quency. preliminary application circuit recommended soldering ref low process evaluation board layout 20~40 sec 260 ? c 200 ? c 150 ? c 60~180 sec ramp - up (3 ? c/sec) ramp - down (6 ? c/sec) size 25 x 25mm in out +vcc (for aln - at, bt, t series C 10x10mm) + - aln out in c1 c2 tantal c a pacitor v dc
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